Austria--(BUSINESS WIRE)--July 27, 2004--EV Group
(EVG), a global supplier of wafer-bonding and lithography
equipment, announced today that it has shipped an
EVG850 production bonder to a new U.S. customer, Umicore
Semiconductor Processing (USP) in Boston. The EVG850
features EV Group's low-temperature, plasma-bonding
USP produces ultra-flat and thin silicon and bonded
thick-film silicon-on-insulator (SOI) for a variety
of applications, including MEMS, MOEMS, microelectronics
and optoelectronics. USP is part of Umicore, the Belgian
precious-metals and advanced-materials producer. Umicore
plans to develop engineered substrates for micro-
and opto-electronics applications.
Umicore, having chosen EV Group's technology after
a lengthy evaluation of vendors, will use the EVG850
for silicon-on-insulator (SOI) wafer bonding and other
engineered substrates manufacturing on 4-inch, 5-inch,
6-inch and 8-inch substrates. EV Group Chief Executive
Officer Dr. Peter Podesser said this purchase will
enable Umicore to combine its crystal-growth and wafer-processing
expertise with EV Group's wafer-bonding technology
to supply engineered substrates to semiconductor and
Umicore is an international metals and materials group.
Its activities are centered on five business areas:
Precious Metals Services, Precious Metals Products
and Catalysts, Advanced Materials, Zinc and Copper.
Each business area is divided into market-focused
Umicore focuses on application areas where it knows
its expertise in materials science, chemistry and
metallurgy can make a real difference, be it in products
that are essential to everyday life or those at the
cutting edge of exciting, new technological developments.
Umicore's overriding goal of sustainable value creation
is based on this ambition to develop, produce and
recycle metals in a way that fulfils its mission:
materials for a better life.
The Umicore Group has industrial operations on all
continents and serves a global customer base; it generated
a turnover of EUR 4.7 billion in 2003 and currently
employs some 11,500 people.
About EV Group
Founded in 1980, EV Group is a global supplier
of wafer bonders, aligners, photoresist coaters, cleaners
and inspection systems for semiconductor, MEMS and
emerging nanotechnology markets. EV Group holds the
dominant share of the market for wafer bonding equipment
(especially SOI bonding) and is a leader in lithography
for advanced packaging and nanotechnology. The company's
unique Triple I approach (Invent - Innovate - Implement)
is supported by a vertical infrastructure, allowing
EV Group to respond quickly to new technology development,
apply the technology to manufacturing challenges and
expedite volume production. Headquartered in Scharding,
Austria, EV Group operates via a global customer support
network, with subsidiaries in Phoenix, Arizona; Cranston,
Rhode Island; Yokohama, Japan; and Chung-Li, Taiwan.
more information, visit www.EVGroup.com.
Dr. Ursula Deinhammer, + 220.127.116.11.11.40.09
Luz Rodriquez, + 18.104.22.168.59.30