depth - MEMS...
Pushes Microdevice Design
to New Heights
technology now enables cost-efficient
3-D microdevices millimeters tall
CA - September 7, 2004 - Microfabrica Inc., a leader
in microdevice and microsystem fabrication, has extended
the capability of its EFAB(r) micro-manufacturing
process to offer structures with layer thicknesses
of 2 to 50 microns.
on EFAB technology's unique ability to fabricate three-dimensional
microdevices by depositing many tens of micron-precise
metal layers, the new capability allows designers
to build taller devices and systems quickly and cost-effectively.
The thick-layer capability benefits a wide variety
of applications including inkjet printhead nozzles,
inertial measurement units, magnetic microsystems
and safing/arming/fuzing devices.
to other micro-manufacturing techniques, the thick-layer
capabilities of the EFAB process enable an innovative
combination of the geometric flexibility of surface
micromachining and the high aspect ratio of the LIGA(1)
technique, at a significantly lower cost. Unlike the
LIGA technique, however, EFAB technology is not restricted
to single-layer designs with simple extruded shapes;
it allows many tens of layers of varying-thicknesses
to be stacked on top each other to fabricate complex
and truly 3-D microdevices.
looking for high aspect ratio manufacturing technology,
such as LIGA, have traditionally struggled with high
costs, 2-D geometric limitations, long production
time and limited availability," said Vacit Arat,
president and CEO of Microfabrica. "With the
new thick-layer capabilities of the EFAB process,
Microfabrica can offer a practical, cost-efficient
alternative for high aspect ratio microdevice design."
ability to fabricate thin structures such as springs,
cantilevers and diaphragms within the same device
as thicker structures, such as spacers, anchors or
proof masses, has always been a problem with conventional
micromachining technology. By combining the high aspect
ratio advantages of LIGA with the geometric flexibility
of surface micromachining, EFAB has become the most
versatile microfabrication technology available, making
previously unrealized products and applications possible
for the first time," said Chris Bang, vice president
of design and applications engineering at Microfabrica.
thick-layer process was developed with the support
of a Small Business Innovation Research Phase II grant
from the National Science Foundation. The new capabilities
developed under this grant have been integrated with
Microfabrica's standard EFAB process and are being
made available to customers for immediate use.
further information on Microfabrica and the EFAB process,
please visit www.microfabrica.com.
LIGA - 'Lithographie, Galvanoformung und Abformung'
or Lithography, Electroplating and Molding - is a
type of high aspect ratio micromachining
Founded in 1999, Microfabrica Inc. is a leader in
microdevice manufacturing. The company's breakthrough
proprietary EFAB(r) technology brings a new paradigm
to micro-fabrication, offering unprecedented flexibility,
ease-of-use and quick time-to-market in a wide range
of applications including wireless, consumer electronics,
automotive and military/aerospace. EFAB is the first
manufacturing technology that can fabricate intricate,
truly three-dimensional microdevices by depositing
many tens of precision metal layers. The technology
opens up a world of possibilities for complex microdevices
and microsystems previously impossible or impractical
to manufacture using other approaches.
is headquartered in Burbank, California.
more information, please visit www.microfabrica.com.
story has been adapted from a news release -
Diese Meldung basiert auf einer Pressemitteilung
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